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0.05mm Diameter Silver-Plated Copper Wire With Anti-Oxidation & Corrosion-Proof For Precision Electronics

  • 0.05mm Diameter Silver-Plated Copper Wire With Anti-Oxidation & Corrosion-Proof For Precision Electronics
Lugar de origen Porcelana
Nombre de la marca HUONA
Certificación ISO9001, RoHS
Número de modelo La plata plateó el alambre de cobre
Cantidad de orden mínima 10KG
Precio Need to negotiate
Detalles de empaquetado Cartón/madera
Tiempo de entrega 10-25 días laborables
Condiciones de pago LC, T/T, Unión Occidental
Capacidad de la fuente 100 toneladas/mes

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Datos del producto
Nombre del producto La plata plateó el alambre de cobre Material que platea Plata pura
Diámetro 0,05 mm (±0,003 mm) espesor del revestimiento 0,5–3,0 µm
Alargamiento ≥15% Conductividad ≥105% SIGC (20°C)
Temperatura de funcionamiento -60°C a +200°C Cantidad mínima de pedido 10KG
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Silver-Plated Copper Wire

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0.05mm

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High-Conductivity
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Descripción de producto
Product Description
0.05mm High-Conductivity Silver-Plated Copper Wire
High-performance fine conductor for precision electronic components, featuring a high-purity oxygen-free copper core with uniform silver plating for superior electrical performance.
Product Overview
Silver-plated copper wire (0.05mm diameter) from Huona New Material is a high-performance fine conductor composed of a high-purity oxygen-free copper (OFC) core and a uniform, dense silver plating layer. Manufactured through precision drawing and continuous electroplating processes, this 0.10mm wire delivers excellent electrical conductivity, superior oxidation resistance, and reliable solderability. With a diameter tolerance of ±0.003mm and plating thickness of 0.5-3.0μm, it is widely used in high-frequency signal transmission, miniaturized electronic components, and aerospace wiring applications.
Standard Designations & Core Material Foundation
  • Base Material: High-purity oxygen-free copper (OFC, ≥99.99%)
  • Plating Material: 99.9% pure silver
  • Key Specification: 0.05mm diameter (tolerance ±0.003mm)
  • Plating Thickness: 0.5-3.0μm (customizable)
  • Compliant Standards: ASTM B500, GB/T 4910, IEC 60884
  • Manufacturer: Huona New Material, certified to ISO 9001 and IATF 16949
Key Core Advantages
High Conductivity & Signal Integrity
  • Enhanced Conductivity: Silver's conductivity (63×10⁶ S/m) is higher than copper, reducing signal loss in high-frequency applications. The 0.10mm diameter balances conductivity and flexibility, making it ideal for high-speed data lines.
  • Low Contact Resistance: The silver plating ensures stable, low-resistance connections in connectors and switches, even after repeated mating cycles.
Excellent Oxidation & Corrosion Resistance
  • Silver Protective Layer: The dense silver coating prevents copper oxidation at high temperatures or in humid environments, maintaining long-term conductivity stability.
  • Corrosion Resistance: Resists sulfurization and most chemical corrosion, suitable for harsh environments such as aerospace and industrial control systems.
Good Mechanical Properties & Processability
  • Ductility & Flexibility: Elongation ≥15% (annealed) allows bending and winding on small mandrels (≥0.2mm) without breaking, suitable for fine-pitch components.
  • Uniform Plating: Advanced electroplating technology ensures a smooth, consistent silver layer with no peeling or blistering, even after drawing and annealing.
Technical Specifications
Attribute Value (Typical)
Base Material Oxygen-Free Copper (OFC)
Plating Material Pure Silver
Diameter 0.05mm (±0.003mm)
Plating Thickness 0.5-3.0μm
Tensile Strength 380-500 MPa (Hard Drawn); 220-300 MPa (Annealed)
Elongation ≥15%
Conductivity ≥105% IACS (20°C)
Operating Temperature -60°C to +200°C
Surface Finish Bright silver, smooth, oxide-free
Product Specifications
Item Specification
Supply Form Spools (100m/500m/1000m per spool)
Plating Type Soft silver plating (for soldering) or hard silver plating (for wear resistance)
Packaging Vacuum-sealed bags + anti-static packaging + outer carton
Customization Diameter (0.02-0.5mm); plating thickness; pre-tinning
Typical Application Scenarios
  • Miniaturized Electronics: Fine-pitch connectors, flexible circuits, and bonding wires for smartphones, wearables, and medical devices.
  • High-Frequency Communication: RF cables, antenna elements, and microwave components requiring low loss and high conductivity.
  • Aerospace & Defense: Lightweight wiring harnesses, sensor leads, and high-frequency signal lines in aircraft and satellite systems.
  • Automotive Electronics: Sensor wires and high-speed data lines in ADAS and infotainment systems.

0.05mm Diameter Silver-Plated Copper Wire With Anti-Oxidation & Corrosion-Proof For Precision Electronics 0

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