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Legura de baja expansión
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Aleación magnética suave
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¿Qué quieres decir?Recibimos la mercancía, todo salió bien. Embalaje perfecto, buena calidad del producto, buen precio - estamos satisfechos. -
El mayo.La calidad del producto es muy buena, más allá de mis expectativas, el uso real de satisfacer plenamente mis necesidades, vamos a comprar de nuevo. -
¿Qué quieres decir?Compré aleación de baja expansión de Joy. Ella es una señora muy responsable. La calidad de los productos de Huona es bastante buena.
Hermetic Sealing Metal Package Header with Kovar Alloy and Customizable Pin Configuration
| Lugar de origen | Porcelana |
|---|---|
| Nombre de la marca | HUONA |
| Certificación | ISO9001 |
| Número de modelo | A |
| Cantidad de orden mínima | 100 piezas |
| Precio | 30 |
| Detalles de empaquetado | CARGA |
| Tiempo de entrega | 15 días |
| Capacidad de la fuente | 10000 unidades/mes |
Datos del producto
| Materia prima | Aleación Kovar / Acero inoxidable / Aleación de cobre | material de vidrio | vidrio de borosilicato |
|---|---|---|---|
| Material de la ventaja | Kovar Alloy | Final | Chapado en oro / niquelado / estañado |
| Número de pines | 2-10 pines personalizables | Tipo de sellado | Sello hermético de vidrio a metal |
| Tasa de filtración | ≤1×10⁻⁹ Pa*m³/s | Resistencia de aislamiento | ≥10⁹ Ω a 100 V CC |
Descripción de producto
Product Overview
Metal package headers are widely used in semiconductor devices, electronic components, sensors, and optoelectronic modules that require reliable hermetic sealing. These headers provide a stable platform for mounting electronic chips while protecting internal components from moisture, dust, and environmental contamination.
The metal body is commonly manufactured from Kovar alloy, stainless steel, or copper alloys, offering excellent mechanical strength, thermal stability, and compatibility with glass sealing materials. Metal headers provide high insulation resistance, strong structural integrity, and excellent reliability for demanding electronic applications.
They are widely used in semiconductor packaging, optical communication modules, industrial sensors, aerospace electronics, and medical equipment.
Technical Parameters
| Item | Specification |
|---|---|
| Product Type | Metal Package Header |
| Package Structure | Hermetic Metal Package |
| Base Material | Kovar Alloy / Stainless Steel / Copper Alloy |
| Glass Material | Borosilicate Glass |
| Lead Material | Kovar Alloy |
| Lead Finish | Gold Plated / Nickel Plated / Tin Plated |
| Number of Pins | 2–10 Pins Customizable |
| Sealing Type | Glass-to-Metal Hermetic Seal |
| Leak Rate | ≤1×10⁻⁹ Pa·m³/s |
| Insulation Resistance | ≥10⁹ Ω at 100 V DC |
| Operating Temperature | -55°C to +200°C |
| RoHS Compliance | Yes |
Custom Attributes
| Attribute | Value |
|---|---|
| Product Name | Metal Package Header |
| Alternate Name | Metal Can Package / Hermetic Metal Package |
| Package Type | Hermetic Metal Package |
| Base Material | Kovar Alloy / Stainless Steel |
| Glass Type | Borosilicate Glass |
| Lead Material | Kovar Pins |
| Lead Plating | Gold Plated / Nickel Plated / Tin Plated |
| Pin Configuration | Customizable |
| Sealing Technology | Glass-to-Metal Sealing |
| Leak Rate | ≤1×10⁻⁹ Pa·m³/s |
| Insulation Resistance | ≥10⁹ Ω |
| Surface Treatment | Nickel Plating / Gold Plating |
| Manufacturing Process | Precision Stamping and Glass Sealing |
| Quality Control | Hermetic Test / Electrical Test / Visual Inspection |
| Certification | RoHS Compliant |
| Customization | Available According to Drawings |
Product Features
| Feature | Description |
|---|---|
| Hermetic Sealing | Reliable airtight sealing for electronic devices |
| High Mechanical Strength | Durable metal structure for long-term use |
| Excellent Thermal Stability | Stable performance under temperature changes |
| High Electrical Insulation | Prevents electrical leakage and interference |
| Flexible Customization | Various pin configurations and plating options |
Typical Applications
| Application Area | Example Use Case |
|---|---|
| Semiconductor Devices | Transistors and integrated circuits |
| Optoelectronic Devices | Laser diodes and photodiodes |
| Sensor Modules | Infrared sensors and pressure sensors |
| Optical Communication | Optical transmitters and receivers |
| Aerospace Electronics | High reliability electronic modules |
| Medical Equipment | Precision electronic detection systems |
Packaging and Delivery
| Item | Details |
|---|---|
| Packaging | Vacuum sealed trays packed in export cartons |
| Lead Time | 7–15 working days depending on order quantity |
| Shipping | Air freight, sea freight, or international express |
| Traceability | Each tray labeled with lot number and product code |
| Minimum Order Quantity | Negotiable depending on customization |
Customization Capability
Our experienced R&D team can design and manufacture metal package headers according to customer drawings and technical requirements. Custom dimensions, pin configurations, plating types, and packaging solutions are
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